Integration Technologies for Sensors Using LTCC

An introduction into the subject is given in the context of packaging solutions for sensor applications. Based on a comparison of economical and technical parameters the driving forces to use LTCC are demonstrated. Following these arguments, some actual applications in the field of sensor will be presented outlining in detail the advantages of LTCC and the actual state of the art. This will be completed by technical information of the materials used, the processes applied and the design rules followed. The capability of System in Package integration i.e. for fluidics and passive components is very interesting for solving sensor packaging problems in the case of specific request concerning reliability and miniaturization. LTCC packaging solutions grant by superior reliability performance compared to all organic techniques, by superior functionality compared to HTCC and by a fraction of the development costs compared to semiconductor integration. Passive components like resistors, capacitors and inductors can be integrated monolithically and the integration of fluidic structures and reaction chambers is feasible. Furthermore, conductor materials can be implemented as transducers into the sensor design and functional coatings having selective or sensitive elements are possible. Thermal management can be applied not only for power dissipation but also for thermal decoupling of sensor elements in the package. All advantages will be demonstrated by the presentation of new developments on materials and processes contributing to advanced packaging solutions.